Resin Bond Micron Diamond

Resin Bond Micron Diamond

Resin Bond Micron Diamond has a sharp surface and high self-sharpness, suitable for grinding tungsten carbide, ceramics and glass.

Item Name: Resin Bond Micron Diamond

Size: 0-0.25~40-60

Applications: Suitable for resin and ceramic bonding tools

Introduction

Crownkyn Superhard resin bond micron diamond is designed for use in vitrified metal and resin bond systems, which is a synthetic material featuring a friable crystal structure. During grinding, grains are microfractured and new edges formed, providing efficient, free-cutting action. Widely used for lapping and surface conditioning on a diverse range of materials, resin bond micron diamond features irregular, elongated, rough-edged crystals that are ideal for grinding tungsten carbide, ceramics and glasses.

Our Resin Bond Diamond Micropowder is processed using state-of-the-art grading equipment to ensure tightly controlled particle size distribution and surface cleanliness for a variety of demanding applications.

Features

  • Rough and sharp surface
  • Brittle polycrystalline structure
  • Concentrated particle size distribution
  • Low magnetic susceptibility
  • Low impurities and has excellent brittleness
  • Self-sharpness, high cutting efficiency

Applications

Crownkyn Superhard resin bond micron diamond is suitable for making resin bonded, ceramic bonded tools and the grinding and polishing of materials with high surface finish requirements, such as carbides, hard alloy, glass, ceramics, crystal. Meanwhile it is suitable for the production of lapping fluid and lapping paste.

Type

Size(μm) MBDM RVDM PCDM WSDM PDM PLM
0-0.25
0-0.5
0-1
0-2
1-2
1-3
1.5-3
2-3
2-4
3-6
3-7
4-6
4-8
4-9
5-10
6-12
8-12
7-14
8-16
10-20
12-22
15-25
20-30
20-40
22-36
30-40
35-45
36-54
40-60

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